Semiconductor device

Semiconductor device

  • CN 1,301,554 C
  • Filed: 09/17/1999
  • Issued: 02/21/2007
  • Est. Priority Date: 09/18/1998
  • Status: Active Grant
First Claim
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1. a semiconductor device possesses:

  • formed the power pad that is used for the supply power current potential, the semiconductor element that is used to supply with the ground pad of earthing potential and is used for the signal pad of input/output signal on an interarea;

    The power supply projection that connects the outside connection usefulness of above-mentioned power pad with power-supply wiring;

    The ground connection projection that connects the outside connection usefulness of above-mentioned ground pad with the ground connection wiring;

    And connect the signal bumps of usefulness with the outside that signal routing connects above-mentioned signal pad, it is characterized in that;

    Middle body at an interarea of above-mentioned semiconductor element, have along the direction on a limit of the outer edge of above-mentioned semiconductor element, with the reiteration of an above-mentioned power pad, an above-mentioned ground pad and an above-mentioned signal pad be provided with the pad row of padAn above-mentioned power pad is connected with 2 above-mentioned power supply projectioies that are arranged on above-mentioned pad row both sides by above-mentioned power-supply wiring at least,An above-mentioned ground pad is connected with 2 that are arranged on above-mentioned pad row both sides above-mentioned ground connection projectioies by above-mentioned ground connection wiring at least,An above-mentioned signal pad is connected with the above-mentioned signal bumps of a certain side in being arranged on above-mentioned pad row both sides by above-mentioned signal routing.

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