Printed circuit board and method of manufacture thereof

Printed circuit board and method of manufacture thereof

  • CN 1,316,175 A
  • Filed: 07/01/1999
  • Published: 10/03/2001
  • Est. Priority Date: 07/08/1998
  • Status: Abandoned Application
First Claim
Patent Images

1. A printed wiring board comprising wiring for a land, a solder resist layer formed on the wiring for the land, and an opening portion formed in the solder resist layer for placing a solder body, wherein the wiring for the land has a rough surface formed by etching with an etching solution containing a copper (II) complex and an organic acid, and the solder resist layer is provided on the rough surface.

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