Method of forming molten through hole structure

Method of forming molten through hole structure

  • CN 1,321,456 C
  • Filed: 03/13/2003
  • Issued: 06/13/2007
  • Est. Priority Date: 07/19/2002
  • Status: Active Grant
First Claim
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1. the anti-pore structure that is melt through is characterized in that, comprises:

  • One ground, it has one first lead and is positioned at one first dielectric layer of this ground top, has the conductor embolism in this first dielectric layer;

    One first electrode is positioned at this conductor embolism top;

    Be positioned at one second dielectric layer on this ground, have an anti-hole opening that is melt through, the wherein anti-hole opening that is melt through is had a mind to misalignment in this conductor embolism;

    One the 3rd dielectric layer is positioned at this second dielectric layer top of part and is positioned at this sidewall that resists the hole opening that is melt through top;

    One second electrode is positioned at the 3rd dielectric layer top;

    AndOne second lead is positioned at this second electrode top.

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