Method for removing stain from through-hole

Method for removing stain from through-hole

  • CN 1,404,120 A
  • Filed: 08/07/2002
  • Published: 03/19/2003
  • Est. Priority Date: 08/08/2001
  • Status: Active Application
First Claim
Patent Images

1. method, feature comprises:

  • Form through hole in the insulating barrier on conductive layer;

    Adopt soft etchant to remove the stain above the partially conductive layer of remaining in of via bottoms by soft etching;

    Form the chemical copper electrodeposited coating by carrying out the chemical copper plating in the total inner surface of the through hole that comprises the bottom;

    With electroplate in through hole, to form and fill electrodeposited coating by carrying out cathode copper, the method is characterized in that;

    Soft etchant is a kind of aqueous solution that contains inorganic acid and hydrogen peroxide, and wherein the concentration of inorganic acid is 1.4 times of concentration of hydrogen peroxide or still less.

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