EMI and RFI shielding for printed circuit boards

EMI and RFI shielding for printed circuit boards

  • CN 1,442,033 A
  • Filed: 03/28/2001
  • Published: 09/10/2003
  • Est. Priority Date: 04/21/2000
  • Status: Abandoned Application
First Claim
Patent Images

1. circuit board, it comprises:

  • A substrate;

    A ground wire and at least one electronic component are coupled on this substrate;

    The profiling insulating coating is arranged on this substrate with encapsulating electronic components;

    AndA conductive layer, on this insulating coating and contact this ground wire, wherein, the conductive layer of this ground connection forms an electromagnetic interference shields that is used for this electronic component by vacuum metallization processes.

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