Method for improving unevenness in chemico-mechanical polishing

Method for improving unevenness in chemico-mechanical polishing

  • CN 1,447,391 A
  • Filed: 03/21/2002
  • Published: 10/08/2003
  • Est. Priority Date: 03/21/2002
  • Status: Active Application
First Claim
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1. method of improving the polishing unevenness of semiconductor wafer, this semiconductor wafer is provided with a conductive layer, and this method comprises the following steps:

  • Utilize one first chemical solution to clean this conductive layer surface;

    AndUtilize one second chemical solution to remove this conductive layer of part, and make remaining this conductive layer have the surface of a general planar.

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