Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices

Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices

  • CN 1,447,981 A
  • Filed: 08/20/2001
  • Published: 10/08/2003
  • Est. Priority Date: 08/21/2000
  • Status: Active Application
First Claim
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1. composition wherein contains the product of silane bond hydrolysis or partial hydrolysis, and this bond comprises:

  • (a) have at least one alkoxy silane of directly linking the alkyl on the silicon atom or acyloxysilanes, this alkyl contains a non-aromatics, unsaturated carbon carbon bond, and(b) have at least one alkoxy silane of directly linking the alkyl on the silicon atom or acyloxysilanes, this alkyl contains an aromatic ring.

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