Packaging mould with electrostatic protection

Packaging mould with electrostatic protection

  • CN 1,479,358 A
  • Filed: 08/26/2002
  • Published: 03/03/2004
  • Est. Priority Date: 08/26/2002
  • Status: Active Application
First Claim
Patent Images

1. the encapsulating mould with electrostatic defending is characterized in that, comprising:

  • One sleeve district has a plurality of sleeves and runner, and each sleeve branch is communicated to these runners, and sealing promptly is pressed to these runners by each these sleeve;

    AndAt least one supporting part, in order to carry a plurality of substrates with chip, these supporting parts are connected to these runners, reception is from the sealing of runner, to encapsulate these suprabasil chips, each these supporting part has a loading end and contact with these substrates, and these loading ends have surface roughening to be handled, thereby minimizing encapsulates the back static that is produced between these substrates and this loading end when mould.

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