Semiconductor chip processing method including back surface lapping

Semiconductor chip processing method including back surface lapping

  • CN 1,487,566 A
  • Filed: 08/29/2003
  • Published: 04/07/2004
  • Est. Priority Date: 08/30/2002
  • Status: Active Application
First Claim
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1. , a kind of method of processing semiconductor wafer, this wafer define a positive and back side, and once process in advance by a lappingout step and overleaf on have a lappingout and damage, said method comprising the steps of:

  • The grinding wafers back side to be removing wafer material, and roughly eliminates the lappingout damage;

    Overleaf after the grinding steps, the successively back side and the front of polished wafer in regular turn.

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