Heat conduction of audio frequency device

Heat conduction of audio frequency device

  • CN 1,491,066 B
  • Filed: 09/16/2003
  • Issued: 11/14/2012
  • Est. Priority Date: 09/18/2002
  • Status: Active Grant
First Claim
Patent Images

1. PA-system comprises:

  • Audio drivers, it comprises;

    Truncated cone shape vibration surface, this surface define a truncated cone shape volume, and said vibration surface comprises medial surface and lateral surface, and said truncated cone shape volume is a characteristic with one;

    Machinery is coupled to the supporting construction on the said vibration surface;

    This supporting construction has axially extends so that seal the frame part of one second volume away from said medial surface;

    Said second volume and said truncated cone shape volume adjacency, said truncated cone shape volume and said second volume form an internal capacity;

    Said PA-system also comprises;

    The vibration motor apparatus, it is coupled on the said vibration surface, is used to cause said vibration surface to vibrate vertically, makes air in said internal capacity, move;

    Electro-heat equipment, this electro-heat equipment and said vibration motor apparatus are completely different;

    AndRadiator;

    It is thermally coupled on the said electro-heat equipment, is used to conduct the heat from said electro-heat equipment, wherein;

    The said frame part of said audio drivers is constructed and be installed to said electro-heat equipment and said radiator, and the suitable major part of said radiator is in the said internal capacity.

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