Packaging of low application hot metal adhesive formulations

Packaging of low application hot metal adhesive formulations

  • CN 1,531,499 A
  • Filed: 10/31/2001
  • Published: 09/22/2004
  • Est. Priority Date: 11/04/2000
  • Status: Active Application
First Claim
Patent Images

1. the low temperature hot melt adhesive of a packing, it comprises and is packaged in fusing point and is lower than low temperature hot melt adhesive in about 100 ℃

  • thermoplastic film.

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