Electronic assembly inculding die having integrated circuit and layer of diamond and methods for producing the same
Electronic assembly inculding die having integrated circuit and layer of diamond and methods for producing the same
- CN 1,539,166 A
- Filed: 07/31/2002
- Published: 10/20/2004
- Est. Priority Date: 07/31/2001
- Status: Abandoned Application
- EN CH
-
- Pin
