Electronic assembly inculding die having integrated circuit and layer of diamond and methods for producing the same

Electronic assembly inculding die having integrated circuit and layer of diamond and methods for producing the same

  • CN 1,539,166 A
  • Filed: 07/31/2002
  • Published: 10/20/2004
  • Est. Priority Date: 07/31/2001
  • Status: Active Application
First Claim
Patent Images

1. wafer comprises:

  • The solid diamond layer;

    WithA plurality of integrated circuits on described solid diamond layer.

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