Hot melt adhesive

Hot melt adhesive

  • CN 1,590,488 A
  • Filed: 07/01/2004
  • Published: 03/09/2005
  • Est. Priority Date: 07/03/2003
  • Status: Active Application
First Claim
Patent Images

1. the hot melt adhesives of low application temperature, its 300 °

  • F or under temperature use, wherein adherent caking agent heat stress value and caking agent application temperature are separately 110 °

    F or following.

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