Hot melt adhesive

Hot melt adhesive

  • CN 1,590,488 B
  • Filed: 07/01/2004
  • Issued: 09/25/2013
  • Est. Priority Date: 07/03/2003
  • Status: Active Grant
First Claim
Patent Images

1. hot melt adhesives, it comprises mixture, wax and the tackifying resin of ethylene n-butyl acrylate copolymer and ethylene vinyl acetate copolymer, this caking agent 200 °

  • F or under temperature use, viscosity is 800cps-1500cps under the bonding application temperature, and wherein separately 100 or following of bonding caking agent heat stress value and caking agent application temperatures.

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