Method and apparatus for cutting protective tape

Method and apparatus for cutting protective tape

  • CN 1,610,071 A
  • Filed: 10/13/2004
  • Published: 04/27/2005
  • Est. Priority Date: 10/17/2003
  • Status: Active Application
First Claim
Patent Images

1. one kind is used to cut the method that is attached to the boundary belt on the pattern semiconductor wafer surface formed thereon, and this method moves cutter blade cutting by the periphery along semiconductor wafer, and described method comprises the steps:

  • Mobile cutter blade under the contacted state of periphery of the side of cutter blade and semiconductor wafer cuts the boundary belt that is attached on the semiconductor wafer surface by this.

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