Method for monitoring wafer defect

Method for monitoring wafer defect

  • CN 1,629,624 A
  • Filed: 12/19/2003
  • Published: 06/22/2005
  • Est. Priority Date: 12/19/2003
  • Status: Active Application
First Claim
Patent Images

1. , a kind of method of monitoring wafer defect is characterized in that it may further comprise the steps:

  • One wafer is provided, has a defective on this wafer;

    Carry out a chemical treatment step, to enlarge this defective;

    On this wafer, form a conformal material layer;

    AndDetect this defective on this wafer.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×