Tin oxide powder for ITO sputtering target, manufacturing method of said powder, sintered body sputtering target for ITO film deposition, and manufacturing method of said target

Tin oxide powder for ITO sputtering target, manufacturing method of said powder, sintered body sputtering target for ITO film deposition, and manufacturing method of said target

  • CN 1,633,516 A
  • Filed: 02/15/2002
  • Published: 06/29/2005
  • Est. Priority Date: 03/12/2001
  • Status: Active Application
First Claim
Patent Images

1. ITO the sputtering target stannic oxide powder is characterized in that, from size-grade distribution try to achieve the footpath in the scope of 0.40~

  • 1.0 μ

    m, and in the scope of 90% particle diameter below 3.0 μ

    m of trying to achieve from size-grade distribution.

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