Printed circuit board blind hole quality analysing method

Printed circuit board blind hole quality analysing method

  • CN 1,641,315 A
  • Filed: 01/16/2004
  • Published: 07/20/2005
  • Est. Priority Date: 01/16/2004
  • Status: Active Application
First Claim
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1. the blind hole mass analysis method of a printed circuit board (PCB) is characterized in that comprising the following step:

  • The design data of blind hole and actual measurement data on the infput sheet;

    Calculate the deviation statistics amount of this blind hole, this deviation statistics amount comprises the relative information of copper window information, pad information, cull information and copper window and pad;

    By information that need to select demonstration in this deviation statistics amount;

    With this information with image or graphical presentation.

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