Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

  • CN 1,659,684 A
  • Filed: 06/11/2003
  • Published: 08/24/2005
  • Est. Priority Date: 06/11/2002
  • Status: Active Application
First Claim
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1. method that is used for the making space optical modulator, it comprises:

  • But on first or second substrate, form a plurality of deflecting reflection elements;

    Described first and second substrates are combined, form a substrate parts;

    Described substrate parts is attached on the package substrate, this package substrate and the incomplete described substrate parts of encapsulation, thus form an exposure and packed substrate parts;

    WithWith lead-in wire described substrate parts is attached to described package substrate.

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