Method and apparatus for cleaving a wafer, method and apparatus for manufacturing semiconductor device

Method and apparatus for cleaving a wafer, method and apparatus for manufacturing semiconductor device

  • CN 1,667,798 A
  • Filed: 03/07/2005
  • Published: 09/14/2005
  • Est. Priority Date: 03/08/2004
  • Status: Active Grant
First Claim
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1. wafer dividing method comprises:

  • On the chip cut-off rule or slice of the splitting surface of wafer, form the starting point of riving that constitutes by at least one side in ditch and the through hole;

    In above-mentioned starting point of riving, inject aqueous material;

    WithAdd that the external factor that physical property ground changes makes above-mentioned fraction qualitative changeization, utilizes this variation to rive above-mentioned wafer to be divided into semiconductor chip one by one.

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