Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units

Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units

  • CN 1,684,234 A
  • Filed: 03/03/2005
  • Published: 10/19/2005
  • Est. Priority Date: 03/03/2004
  • Status: Active Grant
First Claim
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1. be used to prepare method with the low especially wafer disk of at least one active surface that applies with known method and stress, active surface wherein has the defective that seldom causes the coating disappearance, this method comprises by polish described surface and wherein utilize the polishing element to come active surface is polished of polishing step, the method is characterized in that, utilize polishing tool to smear this wafer surface, make last each position on each direction of 360 °

  • of round angles, surface to be applied to equably by statistics in the mode of continuous change polishing direction.

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