Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

  • CN 1,685,507 B
  • Filed: 05/23/2003
  • Issued: 08/18/2010
  • Est. Priority Date: 05/23/2002
  • Status: Active Grant
First Claim
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1. method that is used to make element (10), described element has the conductor arrangement of the radio frequency applications of being applicable to, comprises the steps:

  • -by evaporation structurized deposition of layers of glass being arrived on the substrate (1), wherein said glassy layer has at least one opening (8) in bonding pad, contact (71-74) top, and bonding pad, described contact (71-74) is positioned at and is arranged on the on-chip conductor structure;

    And-at least one conductor structure (100,111,112,113) is applied on the described glassy layer, this at least one conductor structure and bonding pad, described contact (71-74) electrically contact.

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