Thermally enhanced package for an integrated circuit

Thermally enhanced package for an integrated circuit

  • CN 1,685,777 A
  • Filed: 12/16/2003
  • Published: 10/19/2005
  • Est. Priority Date: 12/19/2002
  • Status: Active Application
First Claim
Patent Images

1. circuit unit comprises:

  • Heat-conducting substrate;

    Insulator foot;

    WithThe tube core that wherein has integrated circuit, described tube core and described heat-conducting substrate thermo-contact, described heat-conducting substrate is set between described tube core and the described insulator foot.

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