Method for producing high-purty nickel, high-purity nickel formed sputtering target and thin film formed by using said sputtering target

Method for producing high-purty nickel, high-purity nickel formed sputtering target and thin film formed by using said sputtering target

  • CN 1,715,454 A
  • Filed: 10/22/2001
  • Published: 01/04/2006
  • Est. Priority Date: 08/01/2001
  • Status: Active Application
First Claim
Patent Images

1. high purity nickel, it is more than the 5N (99.999 weight %) except that the gas composition, wherein impurity oxygen:

  • below 30 ppm by weight, C, N, S, P, F respectively do for oneself below 10 ppm by weight.

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