Air tight high-heat conducting chip packaging assembly

Air tight high-heat conducting chip packaging assembly

CN
  • CN 1,719,628 A
  • Filed: 07/06/2004
  • Published: 01/11/2006
  • Est. Priority Date: 07/06/2004
  • Status: Active Application
First Claim
Patent Images

1. , a kind of air tight high-heat conducting chip packaging assembly, it comprises substrate, circuit board, chip and diffuser;

  • It is characterized in that described substrate is provided with perforation, location hole and the material hole of establishing pedestal for group;

    Circuit board is provided with perforation, location hole and the material hole of establishing pedestal for group, and the loop is laid on its surface;

    The pedestal upper and lower part is respectively the bigger dish base of less mullion in cross section and cross section;

    The mullion capital is made the cup groove of planting dress ware type depression for chip;

    Chip is planted and is loaded in the mullion cup groove, and is connected with the circuit board surface loop with lead;

    Be provided with correspondence at the bottom of the cover of diffuser and be plugged in substrate and circuit board on the angle of location hole;

    Diffuser is covered in chip, lead and material hole;

    And in diffuser, cover glue through material hole filling formation.

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