With the high density package of wrap around interconnect

With the high density package of wrap around interconnect

  • CN 1,725,483 B
  • Filed: 06/28/2005
  • Issued: 11/25/2015
  • Est. Priority Date: 06/28/2004
  • Status: Active Grant
First Claim
Patent Images

1. one kind has the array (40) of high density electric interconnection system (10), comprising:

  • A) multiple substrate (12) be linked together at coupled surface place;

    WithB) flexibility is wrapped up in around formula interconnecting assembly (14), the second surface (21) of described one in described multiple substrate is extended to from the first surface (19) of described multiple substrate, wherein, a flexibility is wrapped up in and is arranged round the outer surface of a substrate independently around formula interconnecting assembly;

    Wherein this flexibility is wrapped up in and is arranged around the non-coupled surface of formula interconnecting assembly along corresponding substrate, and described substrate does not have the passage of the lamellar body inside through described substrate.

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