Methods and systems for supporting a workpiece and for heat-treating the workpiece

Methods and systems for supporting a workpiece and for heat-treating the workpiece

  • CN 1,729,554 B
  • Filed: 12/19/2003
  • Issued: 05/07/2014
  • Est. Priority Date: 12/20/2002
  • Status: Active Grant
First Claim
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1. be used for the equipment of support semiconductor workpiece, described equipment comprises:

  • Design be used for heating with respect to the surface of the work of most of workpiece to cause the heating system of workpiece thermally-induced motion, wherein said heating system comprises that design is used for the radiating system of radiation surface of the work;

    WithDesign is used for the support system of when allowing workpiece thermally-induced motion supporting workpiece, wherein said support system comprises the supporting component with the movable bonding part engaging with workpiece, wherein said bonding part is movable, to allow workpiece thermally-induced motion in supporting workpiece, the movable bonding part of wherein said supporting component can with workpiece resilient engagement.

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