Chip with buffer layer and electric engagement device applying the chip and display board

Chip with buffer layer and electric engagement device applying the chip and display board

  • CN 1,731,579 A
  • Filed: 07/25/2005
  • Published: 02/08/2006
  • Est. Priority Date: 07/25/2005
  • Status: Active Application
First Claim
Patent Images

1. chip comprises:

  • Body has active surface and non-active surface;

    First connection pad is arranged on this active surface;

    Conductive projection is arranged on this first connection pad;

    AndResilient coating is formed on this non-active surface;

    Wherein, when this chip carries out the hot pressing step by anisotropic conductive film with the substrate with second connection pad, this chip and this substrate bind, this conductive projection is electrically connected with this second connection pad, this resilient coating can hold on the surface of this resilient coating before this hot pressing step and/or during residual foreign matter.

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