Epoxy resin composition and semiconductor device using thereof

Epoxy resin composition and semiconductor device using thereof

  • CN 1,738,864 A
  • Filed: 01/16/2004
  • Published: 02/22/2006
  • Est. Priority Date: 01/17/2003
  • Status: Active Application
First Claim
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1. the composition epoxy resin that is used for packaging semiconductor, said composition makes according to following prescription:

  • (A) has the unitary phenol aralkyl-type epoxy resin of biphenylene on the main chain;

    (B) resol;

    (C) curing catalyst;

    (D) mineral filler;

    And(E) polyethylene wax of oxidation, its dropping point are 60-140 ℃

    , and acid number is 10-100 (mgKOH/g), and number-average molecular weight is 500-20,000, and median size is 5-100 μ

    m.

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