Chip transfer method and apparatus

Chip transfer method and apparatus

  • CN 1,739,186 A
  • Filed: 12/11/2003
  • Published: 02/22/2006
  • Est. Priority Date: 01/16/2003
  • Status: Active Grant
First Claim
Patent Images

1. one kind is used for chip (42) is sent to the method for lead frame (50) from wafer (44), and this method may further comprise the steps:

  • Place wafer (44) and make chip surface in first plane (2), extend;

    Place lead frame (50) and make its mating surface extend in second plane (4), wherein second plane and first plane (2) form first angle (α

    ) that is between 0 ° and

    180 °

    , and first plane and second plane are located to intersect at intersecting lens (8);

    Provide and have at least two transmission heads (14;

    40a, 40b, 40c, 40d) rotary type transfer assembly (12,16,18;

         32), transfer assembly has respectively with first plane (2) become half the pivot center (10a, 10b, 10c) that extends of first angle (α

    ) with second plane (4) in the 3rd plane (6), and this rotation axis extension becomes with described intersecting lens (8) to form at least 0 ° and

    90 °

    second angle (β

    ) at the most;

    Be in the transmission head (14 of chip pick-up position by one of them;

    40a-40d) pick up first chip (42) from wafer (44), simultaneously by another transmission head that is in the chips incorporate position with second chips incorporate on lead frame (50);

    By described one of them transmission head first chip (42) is sent to the chips incorporate position from chip pick-up position;

    AndBy described one of them be in the transmission head (14 of chips incorporate position;

    40a-40d) first chip (42) is incorporated on the lead frame (50), picks up the 3rd chip by another transmission head that is in chip pick-up position from wafer (44) simultaneously.

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