Substrate dividing apparatus and method for dividing substrate

Substrate dividing apparatus and method for dividing substrate

  • CN 1,758,993 A
  • Filed: 01/28/2004
  • Published: 04/12/2006
  • Est. Priority Date: 01/29/2003
  • Status: Active Grant
First Claim
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1. substrate dividing apparatus comprises:

  • Be used on substrate, forming the line of cut formation device of line of cut;

    AndBe used for disconnecting the disconnecting apparatus of substrate along described line of cut;

    Wherein, described release mechanism comprises the device that is used for the hot fluid that injection temperation is enough to make that substrate expands on formed line of cut on the substrate, thereby makes the vertical crackle that extends from line of cut further extend along the thickness direction of substrate.

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