LED package die having a small footprint

LED package die having a small footprint

  • CN 1,759,487 A
  • Filed: 12/03/2003
  • Published: 04/12/2006
  • Est. Priority Date: 12/06/2002
  • Status: Active Application
First Claim
Patent Images

1. a light emitting die encapsulation (10), it comprises:

  • One has the bar substrate (20) of one first end face (22) and one second end face (24), and at least one groove (26) is defined in described bar substrate (20);

    One lays the lead (30) of (run) along the described groove (26) of described bar substrate (20), and described lead (20) terminates in described first end face (22);

    WithOne is installed on the light-emitting diode (LED) (50) on described first end face (22), and described LED (50) contacts with described bar substrate (20) electric heating, and described LED (50) also is connected to described lead (30).

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