System and method for protecting microelectromechanical systems array using structurally reinforced back-plate

System and method for protecting microelectromechanical systems array using structurally reinforced back-plate

  • CN 1,762,786 B
  • Filed: 09/23/2005
  • Issued: 02/13/2013
  • Est. Priority Date: 09/27/2004
  • Status: Active Grant
First Claim
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1. electronic installation, it comprises:

  • One substrate;

    Be formed at the microelectromechanicdevices devices array on the described substrate;

    WithBe positioned on the described array and have an inner surface and the backboard of an outer surface, the described inner surface of described backboard is towards described array, has a gap in the middle of it, described outer surface deviates from described substrate, wherein said gap prevents from being applied to the described microelectromechanicdevices devices array of damage on the described backboardBetween the described inner surface of wherein said backboard and the described substrate one distance changes at described substrate, wherein from a bit measuring described distance to a closest approach of described substrate on the described inner surface of described backboard;

    AndBe formed with one or more ruggedized constructions on the described inner surface of wherein said backboard, and be formed with projection or interval parts on the described ruggedized construction.

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