Thermal interface apparatus, systems, and methods

Thermal interface apparatus, systems, and methods

  • CN 1,768,424 A
  • Filed: 02/19/2004
  • Published: 05/03/2006
  • Est. Priority Date: 03/31/2003
  • Status: Active Application
First Claim
Patent Images

1. equipment comprises:

  • The circuit small pieces that comprises the surface;

    AndComprise the raw material that is connected in lip-deep tin.

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