Electronic component and method of manufacturing same

Electronic component and method of manufacturing same

  • CN 1,781,189 B
  • Filed: 02/04/2004
  • Issued: 04/28/2010
  • Est. Priority Date: 02/13/2003
  • Status: Active Grant
First Claim
Patent Images

1. electronic component, it comprises:

  • Electronic chip;

    AndChip bearing part with sidewall and bottom;

    Wherein said electronic chip is installed in the top, bottom of chip bearing part;

    Described chip bearing part is to the radiation of electronic chip shielding from the electronic component outside;

    A global facility is formed on described sidewall and described bottom,Described chip bearing partly is the part of lead frame;

    Described chip bearing partly have first surface and with described first surface opposing second surface;

    AndDescribed electronic chip is installed in the first surface top of described chip bearing part.

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