Temperature-compensated resistor and fabrication method therefor

Temperature-compensated resistor and fabrication method therefor

  • CN 1,783,427 B
  • Filed: 10/31/2005
  • Issued: 04/25/2012
  • Est. Priority Date: 11/05/2004
  • Status: Active Grant
First Claim
Patent Images

1. method that is used to form temperature-compensated resistor may further comprise the steps:

  • On Semiconductor substrate, form resistor;

    Two ends at said resistor form terminal contacts;

    AndOn said resistor with in the said resistor, form first and second temperature compensating elements;

    Said first temperature compensating element comprise in the said resistor with said terminal contacts separately and in the amplification lateral part at said terminal contacts middle part, said first temperature compensating element have be associated with it be proportional to thermal resistivity ρ

    eThe epi thermal resistance;

    Said second temperature compensating element comprise contact with said resistor and along said resistor arrange and with said terminal contacts separately and at least one contact patterns at said terminal contacts middle part, said second temperature compensating element have be associated with it be proportional to thermal resistivity ρ

    cContact heat resistance;

    Wherein said first and second temperature compensating elements are configured to the epi separately and the contact resistance that squint at least in part and be associated with it along with the change of said resistor temperature.

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