Non-aqueous, non-corrosive microelectronic cleaning compositions

Non-aqueous, non-corrosive microelectronic cleaning compositions

  • CN 1,784,487 A
  • Filed: 02/25/2005
  • Published: 06/07/2006
  • Est. Priority Date: 12/08/2004
  • Status: Active Application
First Claim
Patent Images

1. one kind does not contain cleaning compositions amino acid whose, non-water, and it is used for from microelectronic substrate cleaning photo-resist and resistates, and described cleaning compositions comprises:

  • One or more polar organic solvents,The amine of one or more organic hydroxies, andOne or more of inhibition etching extent have the corrosion inhibition immunomodulator compounds of a plurality of hydroxy functional groups, and it is the compound of following formula;

    T 1-[(CR 1R 2) m-(CR 3R 4) n] p-(CR 5R 6) q-T 2R in the formula 1And R 2In at least one be OH, if R 1And R 2In one be not OH, then it is selected from H, alkyl and alkoxyl group, m is 1 or bigger integer, R 3And R 4Be selected from H, alkyl and alkoxyl group, n is 0 or bigger positive integer, and p is 1 or bigger integer;

    R 5And R 6In at least one be OH, if R 5And R 6In one be not OH, then it is selected from H, alkyl and alkoxyl group, q is 1 or bigger integer;

    T 1And T 2Be selected from H, alkyl, hydroxyalkyl, polyhydroxy alkyl, aminoalkyl group, carbonylic alkyl and amide group, perhaps T 1And T 2Can be connected to form the structure that is selected from alicyclic structure or condensed ring structure.

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