Improved chemical mechanical polishing compositions for copper and associated materials and method of using same

Improved chemical mechanical polishing compositions for copper and associated materials and method of using same

  • CN 1,787,895 A
  • Filed: 05/10/2004
  • Published: 06/14/2006
  • Est. Priority Date: 05/12/2003
  • Status: Active Application
First Claim
Patent Images

1. a CMP composition that is used for planarization copper film comprises abrasive component, rheological agent and solvent.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×