Electrical connections in substrates

Electrical connections in substrates

  • CN 1,791,975 A
  • Filed: 03/22/2004
  • Published: 06/21/2006
  • Est. Priority Date: 03/21/2003
  • Status: Active Grant
First Claim
Patent Images

1. method of making the electric connection line that insulate between conduction or surface, first (14) (top) of semiconductive wafer and second (16) (bottom) surface comprises:

  • In first surface, form groove;

    Set up insulation and surround the district, this wafer part that it will be defined by groove fully and wafer material on every side separate, and outside simultaneously the top of this separating part and lower surface being exposed to.

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