Thermally conductive foam interface materials

Thermally conductive foam interface materials

  • CN 1,798,816 A
  • Filed: 04/14/2004
  • Published: 07/05/2006
  • Est. Priority Date: 05/30/2003
  • Status: Active Application
First Claim
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1. foam thermal boundary material that comprises foam film, film film comprise number-average molecular weight greater than 25,000 the heat of polymerization fusibleness PSA and the blend of 25wt% heat conductive filler at least, and the void volume of described film is at least 5% of a described foam film volume.

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