Data processing for monitoring chemical mechanical polishing

Data processing for monitoring chemical mechanical polishing

  • CN 1,805,825 A
  • Filed: 06/16/2004
  • Published: 07/19/2006
  • Est. Priority Date: 06/18/2003
  • Status: Active Application
First Claim
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1. method that is used to monitor substrate processing comprises:

  • Generate the measurement trace by the one side with the inswept described substrate of sensor of in-situ monitoring system during substrate processing, described measurement trace comprises following data point;

    the value of described data point is subjected to the feature affects of the substrate in the described perception zone during through described substrate in the perception zone of described sensor;

    Use reference trace to revise described measurement trace, described reference trace is represented described of the inswept described substrate of described sensor of described in-situ monitoring system;

    Measure the local attribute that trace is estimated described substrate according to the described back of revising.

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