Data processing for monitoring chemical mechanical polishing

Data processing for monitoring chemical mechanical polishing

  • CN 1,805,825 B
  • Filed: 06/16/2004
  • Issued: 08/17/2011
  • Est. Priority Date: 06/18/2003
  • Status: Active Grant
First Claim
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1. method that is used to detect the substrate polishing, described method comprises:

  • The one side of the sensor scan of in-situ monitoring system being crossed substrate in the process of polished substrate to be obtaining a plurality of data points, and each data point is corresponding to the sample area on the described substrate and have and be subjected to the value of described sensor through the influence of the substrate feature in the perception zone of described substrate;

    Use reference data points to revise the data point that obtains, with to compensating through the distortion that described substrate was caused by the described perception zone of described sensor in the data point that obtains;

    AndEstimate the local attribute of described substrate based on the data point of revising.

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