Abrasive particles, polishing slurry, and producing method thereof

Abrasive particles, polishing slurry, and producing method thereof

  • CN 1,818,002 B
  • Filed: 12/16/2005
  • Issued: 04/10/2013
  • Est. Priority Date: 12/16/2004
  • Status: Active Grant
First Claim
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1. polishing slurries is characterized in that comprising:

  • Abrasive grain, the first particle size of the secondary granule of the persursor material of wherein said abrasive grain are maximum 1% lower size limit during the overall dimension of the persursor material of described abrasive grain distributes;

    Mixing rate, temperature of reaction and the dispersion agent of the raw material of the first particle size of the persursor material of described abrasive grain by controlling described persursor material are conditioned between 20 and 350 μ

    m.

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