Copper powder

Copper powder

  • CN 1,876,281 B
  • Filed: 02/17/2006
  • Issued: 10/16/2013
  • Est. Priority Date: 02/18/2005
  • Status: Active Grant
First Claim
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1. method of improving the copper powder weatherability, described copper powder is suitable for use as the filler in the conductive paste, and the method comprises the step that makes the Sn that comprises 100~

  • 2000ppm in the copper powder, and described copper powder has the average grain diameter D of 0.1~

    2 μ

    m M, at least always the particle diameter of 80% of population particle is positioned at 0.5D M

    1.5D MScope in;

    wherein;

    method by reduction Cu ion in the aqueous solution, in the presence of the Sn ion adds Sn in copper powder;

    described method is included in the step that mixes cuprous oxide and reducing agent in the solution;

    in described solution, exist the cuprous oxide with respect to 100 mass parts to be the protecting colloid of 0.1~

    1.0 mass parts and wherein to have added water-soluble mantoquita;

    wherein with respect to the cuprous oxide of 100mol;

    as water-soluble mantoquita, and cuprous oxide is the cuprous oxide by the electrolysis preparation and the Sn that contains 10~

    1000ppm with the water-soluble mantoquita of the monovalence of 0.1~

    20mol.

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