Modified printed dipole antennas for wireless multi-band communication systems

Modified printed dipole antennas for wireless multi-band communication systems

  • CN 1,886,865 B
  • Filed: 11/22/2004
  • Issued: 08/13/2014
  • Est. Priority Date: 11/24/2003
  • Status: Active Grant
First Claim
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1. for a dipole antenna for portable radio communication device, comprising:

  • The first conducting element, it separates in a part for the second conducting element and with the second conducting element via the first dielectric layer is stacked;

    The first conductive channel connects the first and second conducting elements by the first dielectric layer;

    The first conducting element is L shaped;

    Described the second conducting element is U-shaped roughly, and this U-shaped has bend and a pair of leg separating;

    Described the second conducting element comprises multiple separated buss, described multiple separated bus is from the end of each leg horizontal expansion of described U-shaped described each leg of close described U-shaped, and described multiple separated bus vertically extends with respect to the leg of described U-shaped respectively;

    AndEach in described multiple separated bus on leg is formed for different λ

    0size, wherein different λ

    0for wavelength corresponding to different centre frequencies;

    Via the second dielectric layer and described the second conducting element is stacked and the ground connection conducting element that separates with described the second conducting element, this second dielectric layer is arranged on a side contrary with the first dielectric layer side of described the second conducting element;

    AndVia each article of described the first dielectric layer and described the second conducting element the 3rd stacked and separated conducting element, wherein the 3rd conducting element does not contact the first conducting element;

    AndThe second conductive channel described the 3rd conducting element being connected with described ground connection conducting element through described each dielectric layer.

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