Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

  • CN 1,901,181 B
  • Filed: 04/25/2001
  • Issued: 09/05/2012
  • Est. Priority Date: 09/25/2000
  • Status: Active Grant
First Claim
Patent Images

1. multilayer printed-wiring board, it is by at alternately resin insulating barrier and conductor layer between layer laminate on the substrate, and in above-mentioned interlayer resin insulating layers, forms via hole, and carry out conductivity via above-mentioned via hole between the above-mentioned conductor layer and connect and constitute,This multilayer printed-wiring board is characterised in that:

  • In aforesaid substrate, be formed with the through hole of the resettlement section that becomes electronic component,Contain a plurality of electronic components in this resettlement section,Utilize laser to be formed with via hole in the resin bed on the weld zone of this electronic component, the intermediary layer in the middle of on the weld zone of above-mentioned electronic component, being formed with,Above-mentioned intermediary layer is bigger than the weld zone.

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