Package substrate

Package substrate

  • CN 1,909,226 A
  • Filed: 09/28/1998
  • Published: 02/07/2007
  • Est. Priority Date: 10/17/1997
  • Status: Abandoned Application
First Claim
Patent Images

1. base plate for packaging, form the multi-layer conductive circuit through the multilayer interlayer resin insulating layers, on the surface that IC chip one side is installed be connected on the surface of other substrate one side and form pedestal, be connected at this and carry out resin-sealedly between surface of the side on other substrate and this other substrates, it is characterized in that:

  • Be connected to the pedestal of the side surface on other substrate having formed these on a plurality of through holes.

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