Thin film conductor and method of fabrication

Thin film conductor and method of fabrication

  • CN 1,913,146 B
  • Filed: 08/11/2006
  • Issued: 06/20/2012
  • Est. Priority Date: 08/12/2005
  • Status: Active Grant
First Claim
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1. thin film conductor comprises:

  • Adhesion layer is used for said thin film conductor is adhered to substrate, and said adhesion layer contains the oxidation reaction metal and perhaps contains silicification reaction metal and silver with silver;

    Silver conductive layer is formed on the said adhesion layer;

    AndProtective layer is formed on the said silver conductive layer, and contains oxidation reaction metal and silver,Wherein, Said adhesion layer contains oxidized metal or metal silicide at the interface itself and said substrate;

    Said oxidized metal is to form through oxidation reaction metal in the said adhesion layer and the reaction between the oxygen in the said substrate, and said metal silicide is that reaction between the silicon that is comprised through silicification reaction metal and said substrate in the said adhesion layer forms.

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