Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist

Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist

  • CN 1,938,849 A
  • Filed: 03/25/2005
  • Published: 03/28/2007
  • Est. Priority Date: 03/30/2004
  • Status: Active Application
First Claim
Patent Images

1. device, described device comprises:

  • The substrate that comprises many conductive layers;

    WithBe clipped in the nano combined interlayer dielectric (ILD) between the conductive layer, wherein nano combined ILD layer comprises nano composite material, described nano composite material comprises and has many nanoclay particles and be dispersed in wherein polymer, and described nanoclay particle has high radius-thickness ratio.

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