Semiconductor apparatus and method thereof

Semiconductor apparatus and method thereof

  • CN 1,945,816 A
  • Filed: 10/08/2006
  • Published: 04/11/2007
  • Est. Priority Date: 10/05/2005
  • Status: Active Grant
First Claim
Patent Images

1. semiconductor device is packaged into it and comprises the semiconductor that is provided with electronic circuit, and this semiconductor device comprises:

  • Substrate;

    Semiconductor chip, it has the semiconductor body that is formed with electronic circuit, the projection electrode that is formed at the pad electrode on the semiconductor body and is connected to pad electrode and gives prominence to from the semiconductor body surface, and wherein semiconductor chip is installed on the substrate to form projected electrode thereon from the rear side on surface;

    WithInsulating barrier, this insulating barrier are formed wherein to be imbedded semiconductor chip and from the top surface of this insulating barrier it is polished to the height at the top that exposes projected electrode.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×